Plans for New €3.2B Semiconductor Assembly, Test Facility Underway in Italy

Silicon Box has selected Stantec and its partner, Drees & Sommer, for the new €3.2-billion semiconductor assembly and test facility in northern Italy. Stantec will provide architecture for the administration areas and infrastructure design including overall permitting services, while Drees & Sommer is contributing industrial engineering, architecture, structural engineering, mechanical/electrical engineering and clean room/dry room design for the production and utility buildings. A general contractor has not yet been selected for the project.

Scheduled to begin operations in 2028, the new facility will be located close to Novara, Piedmont, and is expected to create approximately 1,600 jobs in the region. As Silicon Box’s second asset, it will emulate the company’s automated flagship facility in Singapore, which offers advanced large-format panel-level semiconductor packaging solutions.

With a goal to develop advanced technologies critical to scale next-generation applications with lower-cost, enhanced performance and flexibility, the new facility is expected to serve as a catalyst for broader advanced manufacturing investments and innovation in Italy. It will enhance the country’s competitive strengths on key initiatives such as artificial intelligence, data centers, mobile technologies, electric vehicles, radio frequency power amplifiers, wearables and edge computing.

The project will embrace the highest environmental standards, focusing on sustainability and minimizing environmental impact per the European Commission’s requirements.